PCB E-Waste Detection

Synopsys Science Fair 2026 — Automated component detection and recovery from circuit boards

84.5%
Box mAP@50
84.0%
Mask mAP@50
<1mm
Pickup Accuracy
7,559
Training Images

What happens to old circuit boards?

Every year, millions of circuit boards end up in landfills — but many of the components on them are perfectly reusable. The problem is that sorting those tiny resistors, capacitors, and chips by hand is painfully slow, so most of them just get shredded and lost.

This project builds a machine that can see, identify, and physically pick components off a circuit board — automatically. At its core is a YOLO11 instance-segmentation model trained on over 7,500 images to recognize 20 different component types with pixel-level precision. It doesn't just draw boxes — it traces the exact outline of each capacitor, resistor, and IC, hitting 84.5% box mAP and 84.0% mask mAP at IoU 50.

Getting the AI to see was only half the challenge. The model's pixel coordinates then need to become real-world millimeter positions accurate enough for a vacuum nozzle to pick up a component smaller than a grain of rice. A degree-3 polynomial mapping and two-speed BLTouch probing bridge that gap, and a modified 3D printer acts as the robotic arm to physically sort each component into the right bin.

The full system — vision, coordinate transform, and pick-and-place — runs end to end with no human intervention. It was presented at the Synopsys Science Fair 2026.

Key Contributions

  • 1.End-to-end automated pipeline — from camera capture to physical component sorting with no human intervention
  • 2.YOLO11 instance segmentation trained on 7,559 images across 20 component classes with 84.5% detection accuracy
  • 3.Sub-millimeter pickup precision using polynomial coordinate mapping and two-speed BLTouch height probing

Technical Stack

YOLO11PyTorchOpenCVCLAHEKlipperArduinoBLTouchNVIDIA A100

5-Stage Automated Pipeline

1

Capture

4K camera with 3x zoom, CLAHE contrast enhancement, and Laplacian sharpness-based frame selection

2

Detect

YOLO11 Large Segmentation identifies 20 component classes with pixel-level masks

3

Transform

Degree-3 polynomial mapping converts pixel coordinates to millimeter measurements

4

Probe

BLTouch two-speed probing measures component heights with 0.1mm precision

5

Pick & Place

Vacuum nozzle retrieves and deposits components into sorted bins